High flexibility amine curing agent
The Ecflex series of products is a highly flexible modified amine curing agent with a molecular structure design. Mainly used for two-component epoxy adhesives. Ecflex can greatly reduce the brittleness of epoxy materials, improve the resistance of epoxy adhesives to cold and heat shock, peel strength and excessive double 85 damp heat aging. The products can meet ROHS and REACH requirements.
Features：
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Ultra-high flexibility, high shear strength, high peel strength
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Excellent resistance to thermal shock
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High adhesion strength and excellent peel strength to a variety of foundations
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Excellent resistance to damp heat aging
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Non-toxic, non-irritating
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good compatibility and no phase separation with Epoxy resin
Applications：
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Electronic adhesives and electrical potting adhesives with high requirements for resistance to cold and heat shock and damp heat aging
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Gap fillerThermally conductive adhesive for car batteries, Gap filler for battery packs
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Sandwich aluminum honeycomb panel epoxy structural adhesive
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Two-component structural adhesives for bonding plastics and composites
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Coatings and civil engineering adhesives with high crack resistance
Ecflex Curing Agent Product Essential Properties：
Ecflex Performance (1 day cure at 40 degrees with standard liquid BPA epoxy resin)：
Ecflex 固化后产品基本性能-胶粘特性(与标准液体双酚A环氧树脂40度固化1天):
后续处理方式Handling precautions：
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请参考MSDS Please refer to MSDS
储存期和方法Storage life：
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从生产日期开始，至少12个月。At least 12 months from the date of manufacture in the original sealed container at ambient temperature.
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产品密封保存在阴凉遮光干燥环境，产品需要避免接触空气和水。Store away from excessive heat and humidity in tightly closed containers.
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