Harness potting, electronic potting epoxy ahesive
Ecflex-07 and Ecflex-10 are highly flexible modified amine curing agents suitable for wire harness potting and electronic potting epoxy adhesives. This type of epoxy potting compound has high excellent air tightness, mechanical properties and adhesive strength, and is resistant to damp heat aging. ECFLEX curing agent can greatly reduce the brittleness of epoxy materials, improve the resistance of epoxy adhesives to cold and heat shock, peel strength and excessive double 85 damp heat aging. The sample does not contain any plasticizers and meets ROHS and REACH requirements.
Features：
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Ultra-high flexibility, high shear strength, high peel strength
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Excellent resistance to thermal shock
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It has high adhesion strength and excellent peel strength to a variety of foundations
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Excellent resistance to damp heat aging
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Non-toxic, non-irritating - Good compatibility with epoxy resin, no phase separation
Typical product performance：
Performance：
粘接性能：
后续处理方式Handling precautions：
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请参考MSDS Please refer to MSDS
储存期和方法Storage life：
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从生产日期开始，至少12个月。At least 12 months from the date of manufacture in the original sealed container at ambient temperature.
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产品密封保存在阴凉遮光干燥环境，产品需要避免接触空气和水。Store away from excessive heat and humidity in tightly closed containers.
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